iindaba

1) ISubstrate:

Idatha yesiseko se-chip resistor ithathwe kwi-96% ye-al2O3 yeeseramics. Ukongeza kwi-insulation efanelekileyo yombane, i-substrate kufuneka ibe ne-conductivity egqwesileyo ye-thermal kumaqondo aphezulu. Imoto ineempawu ezifana namandla omatshini. Ukongeza, i-substrate kufuneka ibe mcaba kwaye imakishwe ngokuchanekileyo. Khusela ngokupheleleyo umgangatho wokumelana. I-electrode paste iprintwa endaweni.

2) Ifilimu exhathisayo:
I-resistor paste ene-resistivity ethile iprintwa kwi-substrate ye-ceramic, kwaye emva koko i-sintered. IRuthenium dioxide isetyenziswa yodwa ukuncamathela intlama.

3) Ifilimu yokugcina:
Ukuze ugcine umzimba we-resistor, kubalulekile ukugubungela ifilimu ye-resistor kunye nefilimu yokugcina. Kwelinye icala, idlala indima yokugcina oomatshini. Kwelinye icala, umzimba ochasayo ukhuselwe ngegama ukunqanda umchasi ukuba anganxibelelani nabaqhubi abasondeleyo kwaye abangele ukusilela. Kwakhona kunokwenzeka ukukhusela i-electrode ukuba igqitywe ngumbane we-electro-transfer ngexesha lenkqubo ye-electro-transfer, okubangelwa ukuhla komsebenzi wokuchasana. Ifilimu yesondlo yi-paste yeglasi encibilikayo ephantsi, eprintiweyo kwaye ifakwe i-sintered. Inkampani yeChip resistor
4) Electrode:
Ukuqinisekisa ukuthengiswa okulungileyo kunye nokomelela kwe-resistor, isakhiwo se-electrode esinemigangatho emithathu sisetyenziswa yedwa: yangaphakathi. ngaphakathi. I-electrode yangaphandle. I-electrode yangaphakathi yi-electrode yangaphakathi exhunywe kumzimba we-resistor. Idatha ye-electrode kufuneka ikhethwe. Ifilimu yokuchasana inokuchasana okuncinci, ukuhambelana okuqinileyo kunye ne-ceramic substrate, ukuchasana kakuhle kweekhemikhali, kunye nokusebenza lula kwe-electroplating. Ezinye ziprintwa kwaye zifakwe nge-silver-palladium alloy. I-electrode esecaleni ngumaleko we-nickel-plated, owaziwa ngokuba ngumaleko wesithintelo samaza. Umsebenzi wayo kukuphucula ukuxhathisa ubushushu be-welding kunye ne-buffer yokutshatyalaliswa kwe-thermal ye-welding. Iyakwazi ukunqanda ukufuduka kweeyoni zesilivere ukuya kumaleko wefilimu ochasayo, kwaye ithintele umaleko we-electrode wangaphandle we-tin-lead (ekwabizwa ngokuba yi-solderable layer) ekungcoliseni i-electrode yangaphakathi. Umsebenzi wayo kukwenza i-electrode ibe ne-solderability elungileyo kwaye yandise ixesha lokugcinwa kwe-electrode. Ezinye zifakwe i-electroplated nge-tin-lead alloy.

Izichasi zetshiphu ezixande zahlulwe zaba zixhathisi zefilimu ezibhityileyo kunye nezichasi zefilimu ezishinyeneyo ngokwedatha yokuchasa. I-chip inductors Olu hlobo lwe-chip inductors lukwabizwa ngokuba yi-inductors yamandla kunye ne-inductors yangoku ephezulu. I-Chip inductance luphawu lwelophu evaliweyo. I-resistor yefilimu inokuchaneka okuphezulu kunye ne-coefficient yokushisa ephantsi. Ukuqina kulungile, kodwa uluhlu lokumelana luncinci, lufanelekile kwiimveliso ezithambileyo eziphezulu. Izixhasi zefilimu ezishinyeneyo zihlala zisetyenziswa kwiisekethe.