iindaba

1) ISubstrate:

Idatha yesiseko se-chip resistor ithathwe kwi-96% ye-al2O3 yeeseramics.Ukongeza kwi-insulation efanelekileyo yombane, i-substrate kufuneka ibe ne-conductivity egqwesileyo ye-thermal kumaqondo aphezulu.Imoto ineempawu ezifana namandla omatshini.Ukongeza, i-substrate kufuneka ibe mcaba kwaye imakishwe ngokuchanekileyo.Khusela ngokupheleleyo umgangatho wokumelana.I-electrode paste iprintwa endaweni.

2) Ifilimu exhathisayo:
I-resistor paste ene-resistivity ethile iprintwa kwi-substrate ye-ceramic, kwaye emva koko i-sintered.IRuthenium dioxide isetyenziswa yodwa ukuncamathela intlama.

3) Ifilimu yokugcina:
Ukuze ugcine umzimba we-resistor, kubalulekile ukugubungela ifilimu ye-resistor kunye nefilimu yokugcina.Kwelinye icala, idlala indima yokugcina oomatshini.Kwelinye icala, umzimba ochasayo ukhuselwe ngegama ukunqanda umchasi ukuba anganxibelelani nabaqhubi abasondeleyo kwaye abangele ukusilela.Kwakhona kunokwenzeka ukukhusela i-electrode ukuba igxothwe ngumbane we-electro-transfer ngexesha lenkqubo ye-electro-transfer, okubangelwa ukuhla komsebenzi wokuchasana.Ifilimu yesondlo yi-paste yeglasi encibilikayo ephantsi, eprintiweyo kwaye ifakwe i-sintered.Inkampani yeChip resistor
4) Electrode:
Ukuqinisekisa ukuthengiswa okulungileyo kunye nokomelela kwe-resistor, isakhiwo se-electrode esinemigangatho emithathu sisetyenziswa yedwa: yangaphakathi.ngaphakathi.I-electrode yangaphandle.I-electrode yangaphakathi yi-electrode yangaphakathi exhunywe kumzimba we-resistor.Idatha ye-electrode kufuneka ikhethwe.Ifilimu echasayo inokuchasana okuncinci, ukuhambelana okuqinileyo kunye ne-ceramic substrate, ukuchasana kakuhle kweekhemikhali, kunye nokusebenza okulula kwe-electroplating.Ezinye ziprintwa kwaye zifakwe nge-silver-palladium alloy.I-electrode esecaleni ngumaleko we-nickel-plated, owaziwa ngokuba ngumaleko wesithintelo samaza.Umsebenzi wayo kukuphucula ukuxhathisa ubushushu be-welding kunye ne-buffer yokutshatyalaliswa kwe-thermal ye-welding.Iyakwazi ukunqanda ukufuduka kweeyoni zesilivere ukuya kumaleko wefilim ochasayo, kwaye ithintele umaleko we-electrode yangaphandle ye-tin-lead (ekwabizwa ngokuba yi-solderable layer) ekungcoleni i-electrode yangaphakathi.Umsebenzi wayo kukwenza i-electrode ibe ne-solderability elungileyo kwaye yandise ixesha lokugcinwa kwe-electrode.Ezinye zifakwe i-electroplated nge-tin-lead alloy.

Izichasi zetshiphu ezixande zahlulwe zaba zixhathisi zefilimu ezibhityileyo kunye nezichasi zefilimu ezishinyeneyo ngokwedatha yokuchasa.I-chip inductors Olu hlobo lwe-chip inductors lukwabizwa ngokuba yi-inductors yamandla kunye ne-inductors yangoku ephezulu.I-Chip inductance luphawu lwelophu evaliweyo.I-resistor yefilimu inokuchaneka okuphezulu kunye ne-coefficient yokushisa ephantsi.Ukuqina kulungile, kodwa uluhlu lokumelana luncinci, lufanelekile kwiimveliso ezithambileyo eziphezulu.Izixhasi zefilimu ezishinyeneyo zihlala zisetyenziswa kwiisekethe.